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IC Foundry Services

Tronic Semiconductor Solutions provide IC foundry service ranging from mask house and foundry to assembly house and other services.

Mask House Service	Foundry Service
CP Test Service	Assembly House Service
Final Test (FT) Service	Reliability Assurance (RA) Service
Production Service	Failure Analysis (FA) Service

Mask House Service:

Tapeout; Mask Shop/Making; Foundry Fab; Wafer Plan/Start; WAT & Inline Data Analysis; Yield Maintenance/Improvement ; and so on.

Foundry Service:

Tapeout; Mask Shop/Making; Foundry Fab; Wafer Plan/Start; WAT & Inline Data Analysis;Yield Maintenance/enhancement ; FA; and so on

CP Test Service:

Testing House Survey; CP test program development; Probe Card Making; Yield Maintenance/Improvement , FA; and so on.

Assembly House Service:

Assembly House Survey; Assembly Yield Maintenance/Improvement , FA; and so on.

Final Test (FT) Service:

Testing House Survey; FT Test Program development; Load Board/Dut Board/Socket Making; Characterization, Yield Maintenance/Improvement , FA; and so on.

Reliability Assurance (RA) Service:

Reliability House; Device RA (Foundry process RA); Package RA (PCT,TCT, etc.); Product RA (ESD; Latch-up; HTOL; LTOL) ; and so on.

Production Service:

Fab/CP/Assembly/FT Yield maintain/Yield enhancement; FA, Logistic; Change process conditions; and so on.

Failure Analysis (FA) Service:

Failure Analysis; Liquid Crystal Hot Spot; EMMI; SEM; TEM; Auger/ EDX; FIB ; X-ray ; and so on.

Flow chart illustrates each major stages and services.
			Foundry Service 1. Support Tapeout. 2. Support mask making. 3. Support wafer plan/start. 4. Support WAT/In line data analysis. 5. Others.
			CP Test Service 1. Testing house survey. 2. CP test program development & FA. 3. Probe card making. 4. Others.
			Assembly Service 1. Assembly house survey. 2. Yield maintain/enhancement & FA. 3. Others.
			FT Test Service 1. Testing house survey. 2. FT test program development & FA. 3. Load board/Dut board /Socket making. 4. Characterization. 5. Others.
			RA Service 1. Device RA (GOX, Hot carrier …). 2. Package RA (PCT,TCT…). 3. Product RA (ESD,L-U,OLT…). 4. FA. 5. Others.
			Production Service 1. Yield maintain/Yield enhancement & FA 2. Logistic. 3. Change process conditions. 4. Others.

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